1) ELECTRICAL:

1.1 Contact Resistance: 30mΩ Max.

1.2 Insulation Resistance: 1000MΩ Min.

1.3 Withstanding Voltange: 500V DC

1.4 Current Rating: 2.0~2.4A Max.

1.5 Total Mating Force: 40N Max.

1.6 Total Unmating Force: 10N Min.

1.7 Temperature Rage: -55℃~+105℃

2) Material:

2.1 Shell: Copper or Steel Alloy, T=0.30mm

Plating: Ni 100u" Min.

2.2 Contact: Copper Alloy, T=0.25mm

Plating: Au 1u" on contact area, Tin 50u" on Solder Talls

2.3 Housing: Hing Temperature Tnermaplastics